Longtime Apple analyst Ming-Chi Kuo recently revealed that the upcoming iPhone 17 Air will be extremely thin.
Since the Plus model is the weakest-selling iPhone, Apple plans to replace it with its thinnest phone yet in the next generation, which will, by all accounts, be called the iPhone 17 Air. While the exact thickness of the iPhone 17 Air probably won’t be revealed until the fall, Ming-Chi Kuo, one of Apple’s most trusted and popular analysts, has already shared details about it.
According to his sources, the iPhone 17 Air will be just 5.5 millimeters thick at its thinnest point. This is, we would say, incredible. Because of this thickness, Kuo states that the iPhone 17 Air will likely not have a physical SIM card slot, but will rely solely on eSIM due to its ultra-thin design.
However, this could cause problems in certain markets that do not yet allow the sale of mobile phones that support eSIM exclusively.
If this rumor proves to be true, it wouldn’t be the first time Apple has introduced ultra-thin devices. For example, the latest 13-inch iPad Pro is just 5.1 millimeters thick. The iPhone 17 Air probably won’t reach that thinness, but it will clearly come very, very close.
